Invention Grant
- Patent Title: Printed circuit board and method for manufacturing the same
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Application No.: US17726896Application Date: 2022-04-22
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Publication No.: US12035485B2Publication Date: 2024-07-09
- Inventor: Guh Hwan Lim , Chi Seong Kim , Won Seok Lee , Jin Oh Park , Yu Mi Kim , Sang Yun Lee , Eun Sun Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210182612 2021.12.20
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18 ; H05K3/40 ; H05K3/46

Abstract:
A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.
Public/Granted literature
- US20230199976A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-06-22
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