公开(公告)号：US12035485B2

公开(公告)日：2024-07-09

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan Lim ,  Chi Seong Kim ,  Won Seok Lee ,  Jin Oh Park ,  Yu Mi Kim ,  Sang Yun Lee ,  Eun Sun Kim

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.