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1.发明授权Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board 有权电极垫，使用其的印刷电路板以及印刷电路板的制造方法公开(公告)号：US08946911B2
公开(公告)日：2015-02-03
申请号：US13706863
申请日：2012-12-06
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jung Youn Pang , Shimoji Teruaki , Eun Heay Lee , Seong Min Cho , Chi Seong Kim
IPC: H01L23/498 , B32B15/01 , B32B15/04 , C23C18/42 , C23C28/02 , C25D5/10 , C23C18/16 , C23C18/44 , C23C18/54 , H05K3/24 , H01L23/00 , C22C5/02 , C22C5/04 , C23C18/18
CPC classification number: B32B15/018 , B32B15/043 , C22C5/02 , C22C5/04 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/42 , C23C18/44 , C23C18/54 , C23C28/021 , C23C28/023 , C25D5/10 , H01L24/00 , H05K3/244 , H05K2201/09472 , Y10T428/12396 , Y10T428/12514 , Y10T428/12868 , Y10T428/12875
Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
Abstract translation: 提供一种电极焊盘，包括：连接端子部; 包括形成在所述连接端子部上的钯磷（Pd-P）的第一镀层; 以及包含形成在第一镀层上的钯（Pd）的第二镀层。
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公开(公告)号：US11903129B2
公开(公告)日：2024-02-13
申请号：US17691772
申请日：2022-03-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Seong Kim , Won Seok Lee , Guh Hwan Lim , Jin Uk Lee , Jin Oh Park
CPC classification number: H05K1/119 , H05K1/183 , H05K3/0035 , H05K3/0038 , H05K3/0044 , H05K2201/09827 , H05K2201/09854
Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
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公开(公告)号：US20220322533A1
公开(公告)日：2022-10-06
申请号：US17476980
申请日：2021-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sun Kim , Jin Uk Lee , Young Hun You , Chi Seong Kim
Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
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公开(公告)号：US10902994B2
公开(公告)日：2021-01-26
申请号：US15988497
申请日：2018-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Seong Kim , Jun Il Kang , Sa Yong Lee , Gun Hwi Hyung
Abstract: A coil electronic component includes a body including a plurality of insulating layers and coil patterns disposed on the insulating layers, and external electrodes formed on external surfaces of the body and connected to the coil patterns, wherein the external electrodes include first layers being electroless plating layers and second layers formed on the first layers and having a form in which metal particles are dispersed in a polymer base, respectively.
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公开(公告)号：US20230141270A1
公开(公告)日：2023-05-11
申请号：US17691772
申请日：2022-03-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Seong Kim , Won Seok Lee , Guh Hwan Lim , Jin Uk Lee , Jin Oh Park
CPC classification number: H05K1/119 , H05K1/183 , H05K3/0038 , H05K3/0044 , H05K3/0035 , H05K2201/09854 , H05K2201/09827
Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
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Patent Agency Ranking
公开(公告)号：US11490503B2
公开(公告)日：2022-11-01
申请号：US17204058
申请日：2021-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Hwa Park , Chi Seong Kim , Eun Heay Lee , Yo Han Song , Gun Hwi Hyung , Jae Heun Lee , Deok Man Kang , Jin Oh Park
Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
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公开(公告)号：US20220022310A1
公开(公告)日：2022-01-20
申请号：US17204058
申请日：2021-03-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chang Hwa Park , Chi Seong Kim , Eun Heay Lee , Yo Han Song , Gun Hwi Hyung , Jae Heun LEE , Deok Man Kang , Jin Oh Park
Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.
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公开(公告)号：US12035485B2
公开(公告)日：2024-07-09
申请号：US17726896
申请日：2022-04-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Guh Hwan Lim , Chi Seong Kim , Won Seok Lee , Jin Oh Park , Yu Mi Kim , Sang Yun Lee , Eun Sun Kim
CPC classification number: H05K3/4697 , H05K1/115 , H05K3/4038 , H05K3/4644 , H05K2201/09036
Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.
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9.发明申请ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 有权电极板，使用其的印刷电路板和制造印刷电路板的方法公开(公告)号：US20140087205A1
公开(公告)日：2014-03-27
申请号：US13706863
申请日：2012-12-06
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Youn PANG , Shimoji Teruaki , Eun Heay Lee , Seong Min Cho , Chi Seong Kim
CPC classification number: B32B15/018 , B32B15/043 , C22C5/02 , C22C5/04 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/42 , C23C18/44 , C23C18/54 , C23C28/021 , C23C28/023 , C25D5/10 , H01L24/00 , H05K3/244 , H05K2201/09472 , Y10T428/12396 , Y10T428/12514 , Y10T428/12868 , Y10T428/12875
Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
Abstract translation: 提供一种电极焊盘，包括：连接端子部; 包括形成在所述连接端子部上的钯磷（Pd-P）的第一镀层; 以及包含形成在第一镀层上的钯（Pd）的第二镀层。
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公开(公告)号：US11641715B2
公开(公告)日：2023-05-02
申请号：US17476980
申请日：2021-09-16
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Eun Sun Kim , Jin Uk Lee , Young Hun You , Chi Seong Kim
Abstract: A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.
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