公开(公告)号：US11903129B2

公开(公告)日：2024-02-13

申请号：US17691772

申请日：2022-03-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Seong Kim ,  Won Seok Lee ,  Guh Hwan Lim ,  Jin Uk Lee ,  Jin Oh Park

IPC: H05K1/02 ,  H01L23/13 ,  H01L23/66 ,  H05B45/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/119 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0044 ,  H05K2201/09827 ,  H05K2201/09854

Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.

公开(公告)号：US20230141270A1

公开(公告)日：2023-05-11

申请号：US17691772

申请日：2022-03-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chi Seong Kim ,  Won Seok Lee ,  Guh Hwan Lim ,  Jin Uk Lee ,  Jin Oh Park

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/119 ,  H05K1/183 ,  H05K3/0038 ,  H05K3/0044 ,  H05K3/0035 ,  H05K2201/09854 ,  H05K2201/09827

Abstract: A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.

公开(公告)号：US11490503B2

公开(公告)日：2022-11-01

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun Lee ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K3/22 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US20220022310A1

公开(公告)日：2022-01-20

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun LEE ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US12035485B2

公开(公告)日：2024-07-09

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan Lim ,  Chi Seong Kim ,  Won Seok Lee ,  Jin Oh Park ,  Yu Mi Kim ,  Sang Yun Lee ,  Eun Sun Kim

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4697 ,  H05K1/115 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

公开(公告)号：US20240196533A1

公开(公告)日：2024-06-13

申请号：US18208748

申请日：2023-06-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Youn Gyu Han ,  Jin Uk Lee ,  Jin Oh Park ,  Yong Duk Lee

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/32

CPC classification number: H05K1/115 ,  H05K1/03 ,  H05K1/111 ,  H05K3/323 ,  H05K2203/1461

Abstract: A printed circuit board includes a first insulating layer; a connection via penetrating through at least a portion of the first insulating layer and having an upper surface exposed to an upper surface of the first insulating layer; a cavity penetrating through at least a portion of the first insulating layer and having the upper surface of the first insulating layer as a bottom surface of the cavity; a bridge disposed in the cavity and having a first bridge pad disposed on a lower side of the bridge; and a bonding layer including conductive particles connected to the connection via and the first bridge pad.