发明授权
- 专利标题: Substrate processing apparatus, substrate processing system, and maintenance method
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申请号: US17504578申请日: 2021-10-19
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公开(公告)号: US12040166B2公开(公告)日: 2024-07-16
- 发明人: Atsushi Sawachi , Jun Hirose , Takuya Nishijima , Ichiro Sone , Suguru Sato
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: XSENSUS LLP
- 优先权: JP 20175383 2020.10.19
- 主分类号: H01J37/32
- IPC分类号: H01J37/32
摘要:
A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.
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