公开(公告)号：US11569073B2

公开(公告)日：2023-01-31

申请号：US16110201

申请日：2018-08-23

Applicant: Tokyo Electron Limited

Inventor： Jun Hirose ,  Kaoru Oohashi

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67

Abstract: An assembly provided with a coolant flow channel includes a base in which the coolant flow channel is formed; and a protrusion component that is disposed in the coolant flow channel, wherein the protrusion component is liftable or rotatable.

公开(公告)号：US12293937B2

公开(公告)日：2025-05-06

申请号：US17956110

申请日：2022-09-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Uchida ,  Jun Hirose

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/683

Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.

公开(公告)号：US12068139B2

公开(公告)日：2024-08-20

申请号：US15692357

申请日：2017-08-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shin Matsuura ,  Jun Hirose

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/458 ,  H01L21/67

CPC classification number: H01J37/32577 ,  C23C16/45517 ,  C23C16/4585 ,  H01J37/32174 ,  H01J37/32513 ,  H01J37/32633 ,  H01J37/32651 ,  H01J37/32009 ,  H01J37/32091 ,  H01J37/32743 ,  H01L21/67069

Abstract: A plasma processing apparatus of the present disclosure includes a chamber, a shutter, and a contact portion. The chamber has an opening in a sidewall thereof so as to carry a wafer W into the chamber through the opening, and performs therein a predetermined processing on the wafer W by plasma of a processing gas supplied thereinto. The shutter opens or closes the opening by moving along the sidewall of the chamber. The contact portion is formed of a conductive material, and is not in contact with the shutter while the shutter is moving. When the shutter is in the position for closing the opening, the contact portion is displaced in a direction different from the direction of movement of the shutter to come into contact with the shutter.

公开(公告)号：US11532467B2

公开(公告)日：2022-12-20

申请号：US17009908

申请日：2020-09-02

Applicant: Tokyo Electron Limited

Inventor： Takehiro Ueda ,  Jun Hirose ,  Kazuyuki Tezuka

IPC: H01J37/32 ,  H01L21/67

Abstract: A maintenance device has a cover and a fixing member. The cover is in a vacuum atmosphere during substrate processing, is formed to have a size corresponding to a boundary line between a first part and a second part of a processing container, which can be separated into the first part and the second part, or an opening surface separating the first part and the second part, and has airtightness, and visual transparency at least in a part. The fixing member fixes in an airtight manner the cover along the boundary line between the first part and the second part of the processing container or to the opening surface separating the first part and the second part.

公开(公告)号：US11501995B2

公开(公告)日：2022-11-15

申请号：US16737267

申请日：2020-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yohei Uchida ,  Jun Hirose

IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32

Abstract: A mounting table includes a wafer mounting surface mounting a wafer, a ring mounting surface disposed at a radially outer side of the wafer mounting surface and mounting a first ring having a first engaging portion and a second ring having a second engaging portion to be engaged with the first engaging portion, a lifter pin, and a driving mechanism. The second ring has a through-hole extends to reach a bottom surface of the first engaging portion, and the ring mounting surface has a hole at a position corresponding to the through-hole. A lifter pin has a first holding part that fits into the through-hole and a second holding part that extends from the first holding part and has a part protruding from the first holding part. The lifter pin is accommodated in the hole, and a driving mechanism vertically moves the lifter pin.

公开(公告)号：US12040202B2

公开(公告)日：2024-07-16

申请号：US17242736

申请日：2021-04-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Norihiko Amikura ,  Jun Hirose

IPC: H01L21/67 ,  H01L21/687 ,  B25J9/04

CPC classification number: H01L21/67184 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/68707 ,  B25J9/042

Abstract: A processing system capable of increasing an operating time of the processing system is provided. The processing system includes a vacuum transfer module, a plurality of processing modules, a plurality of load-lock modules, and a plurality of atmospheric transfer modules. The vacuum transfer module is configured to transfer a substrate in a pressure lower than an atmospheric pressure. The processing modules are connected to the vacuum transfer module and configured to process the substrate. The load-lock modules are connected to the vacuum transfer module. Each of the atmospheric transfer modules is connected to at least one of the load-lock modules and configured to transfer the substrate in an atmospheric environment.

公开(公告)号：US20150255255A1

公开(公告)日：2015-09-10

申请号：US14721090

申请日：2015-05-26

Applicant: Tokyo Electron Limited

Inventor： Mitsunori Ohata ,  Hidetoshi Kimura ,  Kiyoshi Maeda ,  Jun Hirose ,  Tsuyoshi Hida

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  C23C16/52

CPC classification number: H01J37/32642 ,  C23C16/52 ,  H01J37/32091 ,  H01L21/67069 ,  H01L21/68735

Abstract: There is provided a plasma processing apparatus including a susceptor, having a substrate mounting portion for mounting thereon a substrate; a focus ring including an outer ring and an inner ring; a dielectric ring; a dielectric constant varying device for varying a dielectric constant of the dielectric ring; a grounding body positioned at an outside of the dielectric ring with a gap from a bottom surface of the focus ring; and a controller for controlling a top surface electric potential of the focus ring by controlling a current flowing from the susceptor to the substrate.

Abstract translation: 提供了一种包括基座的等离子体处理装置，具有用于安装基板的基板安装部分; 包括外圈和内圈的聚焦环; 介电环; 用于改变介电环的介电常数的介电常数可变装置; 位于所述电介质环外侧的接地体，与所述聚焦环的底面间隔开间隙; 以及控制器，用于通过控制从基座流到基板的电流来控制聚焦环的顶表面电位。

公开(公告)号：US12040166B2

公开(公告)日：2024-07-16

申请号：US17504578

申请日：2021-10-19

Applicant: Tokyo Electron Limited

Inventor： Atsushi Sawachi ,  Jun Hirose ,  Takuya Nishijima ,  Ichiro Sone ,  Suguru Sato

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/3244 ,  H01J37/32899

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

公开(公告)号：US11443925B2

公开(公告)日：2022-09-13

申请号：US16871464

申请日：2020-05-11

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro Ueda ,  Jun Hirose

IPC: H01J37/32

Abstract: A substrate support for use in a plasma processing chamber includes a substrate support body, a lifter pin and a lift mechanism. The substrate support body has a pin through-hole and the pin through-hole has a female-threaded inner wall. The lifter pin has a base segment, an intermediate segment, and a leading segment. The lifter pin is inserted into the pin through-hole, the intermediate segment is male-threaded, and the male-threaded intermediate segment is screwable to the female-threaded inner wall. The lift mechanism is configured to vertically move the lifter pin relative to the substrate support body.

公开(公告)号：US11309168B2

公开(公告)日：2022-04-19

申请号：US15897228

申请日：2018-02-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro Ueda ,  Jun Hirose

IPC: H01J37/32

Abstract: A maintenance apparatus includes a case and a maintenance mechanism. The case includes an opening having a size corresponding to a second gate of a vacuum processing apparatus including a processing chamber having a first gate through which a substrate is loaded and unloaded and the second gate different from the first gate. The case is attachable to the second gate while maintaining airtightness. The maintenance mechanism is provided in the case and is configured to perform at least one of an operation of detaching a consumed part in the processing chamber through the opening, an operation of attaching a replacement part in the processing chamber and an operation of cleaning the processing chamber.