公开(公告)号：US20210339350A1

公开(公告)日：2021-11-04

申请号：US17246238

申请日：2021-04-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi Sawachi ,  Ichiro Sone ,  Suguru Sato ,  Takuya Nishijima

IPC: B23Q3/155 ,  H01L21/687

Abstract: A part replacement system includes a part storage device configured to store an unused consumable part, and a replacement device that is connected to a processing device and the part storage device, the replacement device being configured to replace a used consumable part installed in the processing device with the unused consumable part stored in the part storage device. The replacement device is moved to a position of the processing device having the used consumable part that requires replacement, and the replacement device is connected to the processing device, and the part storage device is moved to a position of the replacement device connected to the processing device having the used consumable part that requires replacement, and the part storage device is connected to the replacement device.

公开(公告)号：US12040166B2

公开(公告)日：2024-07-16

申请号：US17504578

申请日：2021-10-19

Applicant: Tokyo Electron Limited

Inventor： Atsushi Sawachi ,  Jun Hirose ,  Takuya Nishijima ,  Ichiro Sone ,  Suguru Sato

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/3244 ,  H01J37/32899

Abstract: A substrate processing apparatus is provided. The substrate processing apparatus comprise: a first chamber including a sidewall providing an opening, the first chamber further including a movable part movable upward and downward within the first chamber; a substrate support disposed within the first chamber; a second chamber disposed within the first chamber and defining, together with the substrate support, a processing space in which a substrate mounted on the substrate support is processed, the second chamber being separable from the first chamber and transportable between an inner space of the first chamber and the outside of the first chamber via the opening; a clamp releasably fixing the second chamber to the movable part extending above the second chamber; a release mechanism configured to release the fixing of the second chamber by the clamp; and a lift mechanism configured to move the movable part upward and downward.

公开(公告)号：US11992912B2

公开(公告)日：2024-05-28

申请号：US17246238

申请日：2021-04-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi Sawachi ,  Ichiro Sone ,  Suguru Sato ,  Takuya Nishijima

IPC: B23Q3/155 ,  H01L21/687

CPC classification number: B23Q3/1556 ,  H01L21/68785

Abstract: A part replacement system includes a part storage device configured to store an unused consumable part, and a replacement device that is connected to a processing device and the part storage device, the replacement device being configured to replace a used consumable part installed in the processing device with the unused consumable part stored in the part storage device. The replacement device is moved to a position of the processing device having the used consumable part that requires replacement, and the replacement device is connected to the processing device, and the part storage device is moved to a position of the replacement device connected to the processing device having the used consumable part that requires replacement, and the part storage device is connected to the replacement device.

公开(公告)号：US12002666B2

公开(公告)日：2024-06-04

申请号：US17113031

申请日：2020-12-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Atsushi Sawachi ,  Ichiro Sone ,  Takuya Nishijima ,  Suguru Sato

IPC: H01J37/32 ,  G01J3/443

CPC classification number: H01J37/32972 ,  G01J3/443 ,  H01J37/32733

Abstract: A measuring device for a vacuum processing apparatus including a processing chamber having a first gate for loading and unloading a substrate and a second gate different from the first gate is provided. The measuring device includes a case having art opening that is sized to correspond to the second gate of the processing chamber and is airtightly attachable to the second gate, a decompressing mechanism configured to reduce a pressure in the case, and a measuring mechanism accommodated in the case and configured to measure a state in the processing chamber through the opening in a state where the pressure in the case is reduced by the decompressing mechanism.

公开(公告)号：US20190310002A1

公开(公告)日：2019-10-10

申请号：US16377359

申请日：2019-04-08

Applicant: Tokyo Electron Limited

Inventor： Shin Matsuura ,  Takuya Nishijima

IPC: F25B47/00

Abstract: A processing apparatus includes a first temperature measuring unit configured to measure a surface temperature of a first member exposed in a first closed space, a supply line configured to supply a low-dew point gas into the first closed space and a control unit configured to control a flow rate of the low-dew point gas. The control unit performs a first process to a third process. In the first process, an absolute humidity of a gas within the first closed space at a position of a surface of the first member is specified for the flow rate of the low-dew point gas. In the second process, a saturated absolute humidity at the surface temperature of the first member is specified. In the third process, the flow rate of the low-dew point gas is controlled based on the absolute humidity of the gas and the saturated absolute humidity.