Invention Grant
- Patent Title: Build material composition
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Application No.: US16605123Application Date: 2018-04-12
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Publication No.: US12042859B2Publication Date: 2024-07-23
- Inventor: Tienteh Chen , Vladek Kasperchik
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh, P.C.
- International Application: PCT/US2018/027286 2018.04.12
- International Announcement: WO2019/177635A 2019.09.19
- Date entered country: 2019-10-14
- Main IPC: B22F1/10
- IPC: B22F1/10 ; B22F1/05 ; B22F1/102 ; B22F1/16 ; B22F10/10 ; B22F10/14 ; B22F10/73 ; B29C64/165 ; B33Y10/00 ; B33Y40/10 ; B33Y70/10 ; C08F2/22 ; C08F212/08 ; C08F220/14 ; C08K3/11 ; C09D11/037 ; C09D11/322 ; C09D11/38 ; B22F10/28 ; B82Y30/00

Abstract:
An example of a composition includes a host metal present in an amount of at least about 90 wt % based on a total weight of the composition. A flow additive is also present in an amount of less than about 10 wt % based on the total weight of the composition. The flow additive consists of an organic particle having crosslinked polymer chains, a glass transition temperature (Tg) of at least 90° C., and a primary particle diameter of 100 nm or less.
Public/Granted literature
- US20210139728A1 COMPOSITION Public/Granted day:2021-05-13
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