- 专利标题: Photoresist for semiconductor fabrication
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申请号: US18355641申请日: 2023-07-20
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公开(公告)号: US12044966B2公开(公告)日: 2024-07-23
- 发明人: Chih-Cheng Liu , Yi-Chen Kuo , Yen-Yu Chen , Jr-Hung Li , Chi-Ming Yang , Tze-Liang Lee
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: HAYNES AND BOONE, LLP
- 分案原申请号: US17177008 2021.02.16
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; C07F5/00 ; C07F7/22 ; C07F9/90 ; C07F9/92 ; C07F9/94 ; C07F11/00 ; G03F7/20
摘要:
An organometallic precursor for extreme ultraviolet (EUV) lithography is provided. An organometallic precursor includes an aromatic di-dentate ligand, a transition metal coordinated to the aromatic di-dentate ligand, and an extreme ultraviolet (EUV) cleavable ligand coordinated to the transition metal. The aromatic di-dentate ligand includes a plurality of pyrazine molecules.
公开/授权文献
- US20230367208A1 PHOTORESIST FOR SEMICONDUCTOR FABRICATION 公开/授权日:2023-11-16
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