- 专利标题: Low inductance component
-
申请号: US18194675申请日: 2023-04-03
-
公开(公告)号: US12051548B2公开(公告)日: 2024-07-30
- 发明人: Michael W. Kirk , Marianne Berolini
- 申请人: KYOCERA AVX Components Corporation
- 申请人地址: US SC Fountain Inn
- 专利权人: KYOCERA AVX Components Corporation
- 当前专利权人: KYOCERA AVX Components Corporation
- 当前专利权人地址: US SC Fountain Inn
- 代理机构: Dority & Manning, P.A.
- 主分类号: H01G4/38
- IPC分类号: H01G4/38 ; H01G4/12 ; H01G4/40 ; H01L27/08 ; H01L49/02
摘要:
A low inductance component may include a multilayer, monolithic device including a first active termination, a second active termination, at least one ground termination, and a pair of capacitors connected in series between the first active termination and the second active termination. The lead(s) may be coupled with the first active termination, second active termination, and/or the at least one ground termination. The lead(s) may have respective length(s) and maximum width(s). A ratio of the length(s) to the respective maximum width(s) of the lead(s) may be less than about 20.
公开/授权文献
- US20230238186A1 Low Inductance Component 公开/授权日:2023-07-27
信息查询