- Patent Title: Chip card body, method for forming a chip card body and chip card
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Application No.: US17498828Application Date: 2021-10-12
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Publication No.: US12051640B2Publication Date: 2024-07-30
- Inventor: Walther Pachler , Michael Huber , Jens Pohl , Szabolcs Tompa-Antal
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Banner & Witcoff Ltd.
- Priority: DE 2020126881.5 2020.10.13
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/14 ; H01L23/64

Abstract:
A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.
Public/Granted literature
- US20220115311A1 CHIP CARD BODY, METHOD FOR FORMING A CHIP CARD BODY AND CHIP CARD Public/Granted day:2022-04-14
Information query
IPC分类: