- 专利标题: Chip card body, method for forming a chip card body and chip card
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申请号: US17498828申请日: 2021-10-12
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公开(公告)号: US12051640B2公开(公告)日: 2024-07-30
- 发明人: Walther Pachler , Michael Huber , Jens Pohl , Szabolcs Tompa-Antal
- 申请人: Infineon Technologies AG
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Banner & Witcoff Ltd.
- 优先权: DE 2020126881.5 2020.10.13
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H01L21/48 ; H01L23/14 ; H01L23/64
摘要:
A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.
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