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公开(公告)号：US20240097316A1
公开(公告)日：2024-03-21
申请号：US18463458
申请日：2023-09-08
摘要： An antenna structure for a contactless wearable structure having a plurality of antenna tracks on the substrate, the opposite ends of which are connectable to form an antenna when the substrate is bent, a plurality of capacitor elements on the substrate that are couplable to the antenna for adjusting the resonance frequency of the antenna, and at least one predefined separation region, by means of which it is possible to adjust which of the plurality of capacitor elements are electrically conductively connectable to the antenna when the substrate is bent, in order to form at least one capacitor with a predetermined total capacitance that is electrically conductively coupled to the antenna.
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公开(公告)号：US20220115311A1
公开(公告)日：2022-04-14
申请号：US17498828
申请日：2021-10-12
IPC分类号： H01L23/498 , H01L23/14 , H01L23/64 , H01L21/48
摘要： A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.
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公开(公告)号：US12051640B2
公开(公告)日：2024-07-30
申请号：US17498828
申请日：2021-10-12
IPC分类号： H01L23/498 , H01L21/48 , H01L23/14 , H01L23/64
CPC分类号： H01L23/49822 , H01L21/4857 , H01L23/142 , H01L23/642
摘要： A chip card body including a metal plate having at least one slot which defines a current flow path on the metal plate, and having a coupling region to accommodate a chip with an antenna, wherein the coupling region is configured to inductively couple the metal plate to the antenna of the chip, a dielectric layer applied to the metal plate, an electrically conductive layer applied to a side of the dielectric layer opposite the metal plate, and at least one electrically conductive coupling between the metal plate and the electrically conductive layer, wherein the metal plate, the dielectric layer and the electrically conductive layer form a capacitor.
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公开(公告)号：US20210303962A1
公开(公告)日：2021-09-30
申请号：US17217643
申请日：2021-03-30
发明人： Frank Pueschner , Michael Huber , Thomas Spoettl , Peter Stampka
IPC分类号： G06K19/077
摘要： A chip card having a chip card body with a first recess, and a chip module arranged in the recess, wherein the chip module is arranged with a distance of at most 20 μm between the chip module surface facing the bottom of the recess and the bottom of the recess, wherein the chip card body has a layer thickness from the bottom of the recess up to a surface of the chip card body facing away from the bottom of the recess of at least 200 μm.
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5.发明公开公开(公告)号：US20240078406A1
公开(公告)日：2024-03-07
申请号：US18453055
申请日：2023-08-21
发明人： Jens Pohl , Michael Huber , Frank Püschner , Thomas Spöttl
IPC分类号： G06K19/077 , H01L23/498
CPC分类号： G06K19/0775 , G06K19/07743 , G06K19/07747 , H01L23/49855
摘要： A chip arrangement including a chip module which includes a chip, a contact-based interface in accordance with ISO 7816 which is electrically conductively connected to the chip, and an antenna structure which is electrically conductively connected to the chip and provides a contactless interface, and a carrier which comprises a chip module receptacle and a booster antenna structure which, when the chip module is arranged in the chip module receptacle of the carrier, inductively couples to the antenna structure of the chip module, wherein the chip module is arranged releasably in the chip module receptacle.
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