- 专利标题: Process for preparing a processed filament, including interaction of a segment with at least one beam of electromagnetic radiation of a first kind
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申请号: US16929865申请日: 2020-07-15
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公开(公告)号: US12057244B2公开(公告)日: 2024-08-06
- 发明人: Jörg-Martin Gebert , Paul Schuster , Lisa Meyer
- 申请人: Heraeus Deutschland GmbH & Co. KG , Heraeus Medical Components LLC
- 申请人地址: DE MN Hanau
- 专利权人: Heraeus Medical Components LLC,Heraeus Deutschland GmbH & Co. KG
- 当前专利权人: Heraeus Medical Components LLC,Heraeus Deutschland GmbH & Co. KG
- 当前专利权人地址: US MN St. Paul; DE Hanau
- 代理机构: Dicke, Billig & Czaja, PLLC
- 主分类号: B05D3/06
- IPC分类号: B05D3/06 ; A61B5/00 ; A61B5/1486 ; B05D7/00 ; B05D7/14 ; B05D7/20 ; B23K26/06 ; B23K26/0622 ; B23K26/352 ; B23K26/36 ; H01B1/02 ; H01B13/00 ; H01B13/34 ; B23K26/402 ; B23K101/32 ; B23K101/34
摘要:
One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.
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