Invention Grant
- Patent Title: Film forming apparatus and film forming method
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Application No.: US17002822Application Date: 2020-08-26
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Publication No.: US12065725B2Publication Date: 2024-08-20
- Inventor: Yuta Konno , Toshihiko Nagase , Atsuko Sakata , Kohei Nagata , Ryohei Kitao , Akifumi Gawase , Takeshi Iwasaki
- Applicant: Kioxia Corporation
- Applicant Address: JP Minato-ku
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 19171007 2019.09.20 JP 20118373 2020.07.09
- Main IPC: C23C14/00
- IPC: C23C14/00 ; B01D53/30 ; C23C14/06 ; C23C14/08 ; C23C14/50 ; C23C14/52 ; C23C14/54 ; C23C14/56

Abstract:
A film forming apparatus according to an embodiment includes: a process chamber forming a film on a substrate; an abatement device detoxifying a first exhaust gas exhausted from the process chamber; a first supply pipe for supplying a gas containing water to the process chamber; a first vacuum pump provided in a first flow path of the first exhaust gas between the process chamber and the abatement device; a second vacuum pump provided in the first flow path between the first vacuum pump and the abatement device; and a first detector provided in the first flow path between the second vacuum pump and the abatement device and capable of detecting a hydrogenated gas.
Public/Granted literature
- US20210087669A1 FILM FORMING APPARATUS AND FILM FORMING METHOD Public/Granted day:2021-03-25
Information query
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