Invention Grant
- Patent Title: Fabrication of gate-all-around integrated circuit structures having adjacent island structures
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Application No.: US17026047Application Date: 2020-09-18
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Publication No.: US12068314B2Publication Date: 2024-08-20
- Inventor: Leonard P. Guler , William Hsu , Biswajeet Guha , Martin Weiss , Apratim Dhar , William T. Blanton , John H. Irby, IV , James F. Bondi , Michael K. Harper , Charles H. Wallace , Tahir Ghani , Benedict A. Samuel , Stefan Dickert
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/423 ; H01L29/78 ; H01L29/786

Abstract:
Gate-all-around integrated circuit structures having adjacent island structures are described. For example, an integrated circuit structure includes a semiconductor island on a semiconductor substrate. A first vertical arrangement of horizontal nanowires is above a first fin protruding from the semiconductor substrate. A channel region of the first vertical arrangement of horizontal nanowires is electrically isolated from the fin. A second vertical arrangement of horizontal nanowires is above a second fin protruding from the semiconductor substrate. A channel region of the second vertical arrangement of horizontal nanowires is electrically isolated from the second fin. The semiconductor island is between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.
Public/Granted literature
- US20220093589A1 FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING ADJACENT ISLAND STRUCTURES Public/Granted day:2022-03-24
Information query
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