公开(公告)号：US12068314B2

公开(公告)日：2024-08-20

申请号：US17026047

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Leonard P. Guler ,  William Hsu ,  Biswajeet Guha ,  Martin Weiss ,  Apratim Dhar ,  William T. Blanton ,  John H. Irby, IV ,  James F. Bondi ,  Michael K. Harper ,  Charles H. Wallace ,  Tahir Ghani ,  Benedict A. Samuel ,  Stefan Dickert

IPC: H01L27/088 ,  H01L29/423 ,  H01L29/78 ,  H01L29/786

CPC classification number: H01L27/0886 ,  H01L29/42392 ,  H01L29/7851 ,  H01L29/78696

Abstract: Gate-all-around integrated circuit structures having adjacent island structures are described. For example, an integrated circuit structure includes a semiconductor island on a semiconductor substrate. A first vertical arrangement of horizontal nanowires is above a first fin protruding from the semiconductor substrate. A channel region of the first vertical arrangement of horizontal nanowires is electrically isolated from the fin. A second vertical arrangement of horizontal nanowires is above a second fin protruding from the semiconductor substrate. A channel region of the second vertical arrangement of horizontal nanowires is electrically isolated from the second fin. The semiconductor island is between the first vertical arrangement of horizontal nanowires and the second vertical arrangement of horizontal nanowires.