Invention Grant
- Patent Title: Memory device and method of manufacturing memory device
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Application No.: US18231304Application Date: 2023-08-08
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Publication No.: US12069872B2Publication Date: 2024-08-20
- Inventor: Takahiko Iizuka , Daisaburo Takashima , Ryu Ogiwara , Rieko Funatsuki , Yoshiki Kamata , Misako Morota , Yoshiaki Asao , Yukihiro Nomura
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP 20104662 2020.06.17 JP 21009629 2021.01.25
- The original application number of the division: US17348839 2021.06.16
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00 ; H10B63/00 ; H10N70/00 ; H10N70/20

Abstract:
A memory device includes: a first interconnect; a second interconnect; a first string and a second string whose first ends are coupled to the first interconnect; a third string and a fourth string whose second ends are coupled to the second interconnect; a third interconnect; and driver. The third interconnect is coupled to second ends of the first and second strings and to first ends of the third and fourth strings. Each of the first, second, third, and fourth strings includes a first switch element and a memory cell coupled in series. The memory cell includes a second switch element and a resistance change element coupled in parallel. The third interconnect is coupled to the driver via the first interconnect or the second interconnect.
Public/Granted literature
- US20230413584A1 MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE Public/Granted day:2023-12-21
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