Invention Grant
- Patent Title: Stress analysis device
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Application No.: US17679298Application Date: 2022-02-24
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Publication No.: US12073549B2Publication Date: 2024-08-27
- Inventor: Yousuke Irie , Hirotsugu Inoue , Michiyasu Hirota
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Rimon P.C.
- Priority: JP 19158453 2019.08.30
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G01K11/26

Abstract:
A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.
Public/Granted literature
- US20220180502A1 STRESS ANALYSIS DEVICE Public/Granted day:2022-06-09
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