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公开(公告)号:US12073549B2
公开(公告)日:2024-08-27
申请号:US17679298
申请日:2022-02-24
Inventor: Yousuke Irie , Hirotsugu Inoue , Michiyasu Hirota
CPC classification number: G06T7/0004 , G01K11/26 , G06T2207/20212 , G06T2207/30108
Abstract: A stress analysis device includes: an imaging element that obtains temperature images over a same time range for a same region of an object; a feature point extractor that extracts a feature point in each of the temperature images; a projection transformer that performs projective transformation on each of the temperature images to align the feature point in the temperature images, and aligns the temperature images with respect to a temperature image being a reference; a pixel rearranger that rearranges a pixel array of each of the temperature images subjected to the projective transformation with respect to a pixel array of the temperature image that is the reference; a stress converter that obtains a stress image by multiplying each of the temperature images after pixel rearrangement by a stress conversion coefficient; and an additional averaging part that obtains an additional averaging stress image by adding and averaging the stress images.