- 专利标题： Layered bonding material, semiconductor package, and power module
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申请号： US18288636申请日： 2022-04-18
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公开(公告)号： US12080671B2公开(公告)日： 2024-09-03
- 发明人: Naoto Kameda , Kanta Dei , Masato Tsuchiya
- 申请人： SENJU METAL INDUSTRY CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： SENJU METAL INDUSTRY CO., LTD.
- 当前专利权人： SENJU METAL INDUSTRY CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP 21076312 2021.04.28
- 国际申请： PCT/JP2022/017980 2022.04.18
- 国际公布： WO2022/230697A 2022.11.03
- 进入国家日期： 2023-10-27
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B23K1/00 ; B23K101/40 ; B23K103/12 ; B23K103/16 ; B32B15/01
摘要：
A layered bonding material 10 includes a base material 11, a first solder section 12a stacked on a first surface of the base material 11, and a second solder section 12b stacked on a second surface of the base material 11. A coefficient of linear expansion of the base material 11 is 5.5 to 15.5 ppm/K, the first solder section 12a and the second solder section 12b are made of lead-free solder, and both of a thickness of the first solder section 12a and a thickness of the second solder section 12b are 0.05 to 1.0 mm.
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