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公开(公告)号：US20240238912A1
公开(公告)日：2024-07-18
申请号：US18409939
申请日：2024-01-11
发明人： Takahiro Yokoyama , Shunsaku Yoshikawa , Yuki Iijima , Kanta Dei , Takahiro Matsufuji , Kota Sugisawa , Shigeto Suzuki
CPC分类号： B23K35/262 , B23K35/0244 , B23K35/025 , C22C13/00
摘要： A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：US12053843B2
公开(公告)日：2024-08-06
申请号：US17770142
申请日：2021-06-22
IPC分类号： B23K35/26 , B23K35/02 , C22C13/02 , B23K101/36
CPC分类号： B23K35/262 , B23K35/025 , C22C13/02 , B23K2101/36
摘要： A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.
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公开(公告)号：US20230129147A1
公开(公告)日：2023-04-27
申请号：US17912384
申请日：2021-03-10
发明人： Yuuki Iijima , Hiroshi Okada , Shunsaku Yoshikawa , Takashi Saito , Kanta Dei , Takahiro Matsufuji
摘要： Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0≤Ag×Cu×Ni/P≤25, 0.500≤Sn×P≤0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
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公开(公告)号：US20240238914A1
公开(公告)日：2024-07-18
申请号：US18410462
申请日：2024-01-11
发明人： Takahiro Yokoyama , Shunsaku Yoshikawa , Yuki Iijima , Kanta Dei , Takahiro Matsufuji , Kota Sugisawa , Shigeto Suzuki
IPC分类号： B23K35/26 , B23K35/02 , C22C13/02 , B23K101/42
CPC分类号： B23K35/262 , B23K35/025 , C22C13/02 , B23K2101/42
摘要： A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and 0.9% or less, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：US20240238913A1
公开(公告)日：2024-07-18
申请号：US18410205
申请日：2024-01-11
发明人： Takahiro Yokoyama , Shunsaku Yoshikawa , Yuki Iijima , Kanta Dei , Takahiro Matsufuji , Kota Sugisawa , Shigeto Suzuki
IPC分类号： B23K35/26 , B23K1/00 , B23K35/02 , B23K101/42 , C22C13/02
CPC分类号： B23K35/262 , B23K1/0016 , B23K35/025 , C22C13/02 , B23K2101/42
摘要： A solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition of, by mass %, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: more than 0% and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: more than 0.008% and 0.020% or less, with the balance being Sn. The solder alloy may further contain, by mass %, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
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公开(公告)号：US20240342838A1
公开(公告)日：2024-10-17
申请号：US18746193
申请日：2024-06-18
IPC分类号： B23K35/26 , B23K35/02 , B23K101/36 , C22C13/02
CPC分类号： B23K35/262 , B23K35/025 , C22C13/02 , B23K2101/36
摘要： A solder alloy consisting of Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, As: 0.002 to 0.250% by mass, and a balance Sn.
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公开(公告)号：US12080671B2
公开(公告)日：2024-09-03
申请号：US18288636
申请日：2022-04-18
发明人： Naoto Kameda , Kanta Dei , Masato Tsuchiya
IPC分类号： H01L23/00 , B23K1/00 , B23K101/40 , B23K103/12 , B23K103/16 , B32B15/01
CPC分类号： H01L24/29 , B23K1/0016 , B32B15/01 , H01L24/32 , B23K2101/40 , B23K2103/12 , B23K2103/166 , H01L2224/29083 , H01L2224/29111 , H01L2224/29147 , H01L2224/29155 , H01L2224/2918 , H01L2224/29184 , H01L2224/32225
摘要： A layered bonding material 10 includes a base material 11, a first solder section 12a stacked on a first surface of the base material 11, and a second solder section 12b stacked on a second surface of the base material 11. A coefficient of linear expansion of the base material 11 is 5.5 to 15.5 ppm/K, the first solder section 12a and the second solder section 12b are made of lead-free solder, and both of a thickness of the first solder section 12a and a thickness of the second solder section 12b are 0.05 to 1.0 mm.
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公开(公告)号：US11633815B2
公开(公告)日：2023-04-25
申请号：US17042551
申请日：2019-03-22
发明人： Toru Hayashida , Shunsaku Yoshikawa , Takashi Saito , Kanta Dei
IPC分类号： B23K35/02 , B23K35/26 , B23K35/362 , B23K103/08
摘要： Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
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公开(公告)号：US11607753B2
公开(公告)日：2023-03-21
申请号：US17603500
申请日：2020-06-12
发明人： Shunsaku Yoshikawa , Takashi Saito , Takahiro Matsufuji , Naoko Izumita , Yuuki Iijima , Kanta Dei
摘要： A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)≤0.945% (relation (1)), (P+Ge)≤0.15% (relation (2)), 2.0≤(Cu+5Ni)/(P+Ge)≤1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.
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公开(公告)号：US20230068294A1
公开(公告)日：2023-03-02
申请号：US17799575
申请日：2021-02-08
摘要： Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass%, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013 ≤ (Ag + Cu + Ni + Bi) x Ge ≤ 0.027 (1), Sn x Cu x Ni ≤ 5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass%) in the alloy composition.
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