Invention Grant
- Patent Title: Semiconductor chip
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Application No.: US18358689Application Date: 2023-07-25
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Publication No.: US12080805B2Publication Date: 2024-09-03
- Inventor: Hiroyuki Shimbo
- Applicant: SOCIONEXT INC.
- Applicant Address: JP Kanagawa
- Assignee: SOCIONEXT INC.
- Current Assignee: SOCIONEXT INC.
- Current Assignee Address: JP Kanagawa
- Agency: Rimon P.C.
- Priority: JP 16150960 2016.08.01
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L21/8238 ; H01L27/088 ; H01L27/092 ; H01L27/118 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/775 ; H01L29/786 ; H01L21/8234 ; H01L27/02 ; H01L27/12

Abstract:
Provided is a semiconductor chip including a nanowire field effect transistor (FET) and having a layout configuration effective for making manufacturing the chip easy. A semiconductor chip includes a first block including a standard cell having a nanowire PET and a second block including a nanowire FET. In the first and second blocks, nanowires extending in an X direction have an arrangement pitch in a Y direction of an integer multiple of a pitch P1. Pads have an arrangement pitch in the X direction of an integer multiple of a pitch P2.
Public/Granted literature
- US20240021735A1 SEMICONDUCTOR CHIP Public/Granted day:2024-01-18
Information query
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