- 专利标题： Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
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申请号： US18381288申请日： 2023-10-18
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公开(公告)号： US12084599B2公开(公告)日： 2024-09-10
- 发明人: Emi Miyazawa , Tsuyoshi Hayasaka , Takashi Kawamori , Shinichiro Sukata , Yoshihito Inaba , Keisuke Nishido
- 申请人： RESONAC CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： RESONAC CORPORATION
- 当前专利权人： RESONAC CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： WO TJP2017043363 2017.12.01
- 分案原申请号： US16767908
- 主分类号： C09J4/06
- IPC分类号： C09J4/06 ; B32B7/12 ; B32B17/06 ; B32B37/12 ; B32B43/00 ; C09J7/30 ; C09J9/02 ; C09J11/04 ; H01L21/683
摘要：
Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.
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