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1.
公开(公告)号:US20240355665A1
公开(公告)日:2024-10-24
申请号:US18683052
申请日:2022-08-09
申请人: Resonac Corporation
发明人: Kenta KIKUCHI , Hiroyuki IZAWA , Takashi TATSUZAWA , Mayumi SATO , Yasuo MAEHARA , Hiroshi TAKAIRA , Takahiro FUKUI , Katsuhiko TOMISAKA , Toshiaki MATSUZAKI
IPC分类号: H01L21/683 , C09J7/40 , C09J9/02
CPC分类号: H01L21/6836 , C09J7/403 , C09J9/02 , C09J2203/326 , C09J2301/122 , C09J2301/18 , C09J2301/50 , H01L2221/68318 , H01L2221/68386
摘要: A production method for an adhesive sheet for semiconductor device production including: preparing a backing material-attached laminated body including a laminated body and a backing material; a laminated body cutting step of making an incision in the laminated body along any cut-out shape; and a backing material peeling step of peeling the backing material from the laminated body, wherein in the backing material peeling step, a portion of the laminated body existing in a region surrounded by the incision is attached to the backing material and removed.
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公开(公告)号:US12106775B2
公开(公告)日:2024-10-01
申请号:US18460989
申请日:2023-09-05
申请人: Resonac Corporation
发明人: Fuminobu Oohashi
CPC分类号: G11B25/043 , G11B33/08 , G11B5/532
摘要: A recording and reproducing device including, a case; at least one recording medium having a disk-shape, a motor configured to rotate the at least one recording medium, a head configured to read or write information from or to the at least one recording medium, and an actuator configured to drive the head to scan in a radial direction of the at least one recording medium which are provided in the case; and a regulating portion configured to, when an external shock is applied to the at least one recording medium, contact an outer peripheral edge of the at least one recording medium to regulate displacements of the at least one recording medium due to bending of the at least one recording medium, wherein the regulating portion includes a regulating member which is movable in an axial direction parallel to a rotation axis of the at least one recording medium.
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公开(公告)号:US20240320824A1
公开(公告)日:2024-09-26
申请号:US18574187
申请日:2022-06-24
申请人: Resonac Corporation
发明人: Yu OKANO , Junya SAKAGUCHI , Takumi NAKAJIMA , Shinya HIRASAWA , Shimpei TAKEMOTO , Yoshishige OKUNO
CPC分类号: G06T7/0012 , G06T7/194 , G06T15/00 , G06V10/56 , H04N1/6008 , G06T2207/30096
摘要: An evaluation apparatus, an evaluation method, and an evaluation program applicable to a quality evaluation of sintered bodies are provided. The evaluation apparatus includes: an acquisition unit configured to acquire a cross-sectional image obtained by photographing a cross-section of a sintered body group stained with a staining solution; a generation unit configured to extract a saturation component for each of sintered bodies from the cross-sectional image, thereby to generate a saturation component image; and a visualization unit configured to visualize the saturation component image.
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公开(公告)号:US20240319706A1
公开(公告)日:2024-09-26
申请号:US18578973
申请日:2022-07-15
申请人: Resonac Corporation
IPC分类号: G05B19/4097
CPC分类号: G05B19/4097 , G05B2219/45234
摘要: A material design support apparatus for supporting optimization of a design condition for a material, the material design support apparatus including: a design condition setting unit configured to set a range of a design condition for a material; a required characteristic setting unit configured to set a range of a required characteristic of the material; an exhaustive prediction point generation unit configured to generate a plurality of exhaustive prediction points within the range of the design condition; a prediction unit configured to input the exhaustive prediction points into a trained model in which a correspondence between a design condition for the material and a characteristic value of the material is learned, thereby to predict a characteristic value of the material; and a design condition adjustment unit configured to adjust a range of the design condition for the material in which a plurality of exhaustive prediction points are subsequently generated.
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公开(公告)号:US12093292B2
公开(公告)日:2024-09-17
申请号:US18245061
申请日:2021-09-07
申请人: Resonac Corporation
发明人: Yu Kawahara , Takuya Minami , Yu Okano , Hiroko Takashi , Yoshishige Okuno
IPC分类号: G06F16/00 , G06F16/332 , G06F16/338
CPC分类号: G06F16/332 , G06F16/338
摘要: To improve accuracy in a document search for a document that includes a typographical error. A document retrieval device according to one embodiment of the present invention includes a misidentification table storing a correctly identified character string and a misidentified character string. The document retrieval device includes a document searcher. The document searcher obtains a search character string, and retrieves the search character string from both a document and a character string that is obtained by changing the misidentified character string included in the document to the correctly identified character string.
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公开(公告)号:US20240306486A1
公开(公告)日:2024-09-12
申请号:US18039311
申请日:2021-12-06
申请人: Resonac Corporation
发明人: Takeshi IGARASHI , Chieko NAKAGAWA
IPC分类号: H10K85/20 , C01B32/156 , C07C17/266 , C07C22/08 , C07C23/46 , C07D307/93 , H10K30/30
CPC分类号: H10K85/215 , C01B32/156 , C07C17/266 , C07C22/08 , C07C23/46 , C07D307/93 , C01P2006/40 , C07C2604/00 , H10K30/30
摘要: A fullerene derivative having a partial structure shown in the following General Formula (1) is privided.
(in Formula (1), C*'s are adjacent carbon atoms that form a fullerene framework. Rf1 and Rf2 each independently represents a perfluoroalkyl group having 1 to 4 carbon atoms, and Rf1 and Rf2 may be linked to each other to form a ring structure).-
公开(公告)号:US20240304462A1
公开(公告)日:2024-09-12
申请号:US18569217
申请日:2022-06-15
申请人: Resonac Corporation
发明人: Masaya TOBA , Masaki YAMAGUCHI
IPC分类号: H01L21/48 , C23C18/16 , C23C18/38 , C23C28/02 , C25D3/38 , C25D5/02 , C25D7/12 , H01L23/12 , H05K1/03 , H05K3/18
CPC分类号: H01L21/4857 , C23C18/1641 , C23C18/1653 , C23C18/38 , C23C28/023 , C25D3/38 , C25D5/022 , C25D7/123 , H01L23/12 , H05K1/0366 , H05K3/188 , H05K2203/107
摘要: A method for manufacturing a wiring board includes steps of: (I) forming an insulation material layer on a surface of a support substrate; (II) forming a first conductive layer on a surface of the insulation material layer by electroless copper plating; (III) forming a first opening passing through the first conductive layer and the insulation material layer; (IV) forming a second conductive layer on a surface of the first conductive layer and on a bottom surface and a side surface of the first opening by electroless copper plating; (V) forming a resist pattern having a second opening communicating with the first opening on a surface of the second conductive layer; and (VI) filling the first opening and the second opening with a conductive material including copper by electrolytic copper plating.
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公开(公告)号:US20240282583A1
公开(公告)日:2024-08-22
申请号:US18568637
申请日:2022-06-02
申请人: RESONAC CORPORATION
发明人: Jumpei IWASAKI , Kazuma MATSUI
IPC分类号: H01L21/311
CPC分类号: H01L21/31122
摘要: Provided is a dry etching method capable of selectively etching an etching object containing lanthanum as compared with a non-etching object at a sufficient etching rate without plasma. The dry etching method includes a dry etching step of bringing an etching gas containing nitrosyl fluoride into contact with a member to be etched (12) having an etching object that is to be etched by the etching gas and having a non-etching object that is not to be etched by the etching gas, to selectively etch the etching object as compared with the non-etching object without plasma. The etching object contains lanthanum.
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公开(公告)号:US20240279478A1
公开(公告)日:2024-08-22
申请号:US18566877
申请日:2022-07-07
申请人: Resonac Corporation
发明人: Hiroki KUZUOKA , Tomohiko KOTAKE
IPC分类号: C08L101/12 , C08J5/18 , C08K3/013
CPC分类号: C08L101/12 , C08J5/18 , C08K3/013 , C08J2399/00 , C08K2201/001 , C08L2203/206 , C08L2205/02
摘要: Provided are a resin composition containing (A) a thermosetting resin. (B) a compound that is in a liquid state at 25° C. has a reactive group, and has a molecular weight of 1,000 or less, and (C) an inorganic filler, a resin film using the resin composition, a printed wiring board, and a semiconductor package.
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10.
公开(公告)号:US20240279395A1
公开(公告)日:2024-08-22
申请号:US18285609
申请日:2022-04-07
申请人: Resonac Corporation
发明人: Natsumi SHIBATA , Naoya FUKUMOTO , Ayano ASANO , Tsuyoshi KATO , Takuma KURODA , Daisuke YAGYU , Chizuru KASAHARA , Yutaka TANJI
IPC分类号: C08G65/22 , C10M107/38 , C10N40/18
CPC分类号: C08G65/226 , C10M107/38 , C10N2040/18
摘要: The present invention provides a fluorine-containing ether compound represented by following formula.
R1—CH2—R2—CH2—R3—CH2—R4—CH2—R5—CH2—R6—CH2—R7
(R2, R4, and R6 are perfluoropolyether chains having the structure R3 and R5 are each independently a linking group containing one or more hydroxyl groups, and R1 and R7 are each independently Formula (2).)
—O—CH2—CH(OH)—([D]—CH(OH))s-[E]-CH2OH (2)
(s is 0 or 1, [D] and [E] each independently is a chain structure consisting of a combination of 2 to 5 methylene groups and 1 oxygen atom or a chain structure consisting of 1 to 4 methylene groups, provided that, in case where s is 0 and [E] contains an oxygen atom, the number of methy ne groups contained in [E] is 3 or more).
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