Invention Grant
- Patent Title: Molded packaging for wide band gap semiconductor devices
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Application No.: US17248382Application Date: 2021-01-22
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Publication No.: US12087677B2Publication Date: 2024-09-10
- Inventor: Maria Clemens Ypil Quinones , Bigildis Dosdos , Jerome Teysseyre , Erwin Ian Vamenta Almagro , Romel N Manatad
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/48 ; H01L23/31 ; H01L23/482 ; H01L23/00 ; H01L23/544

Abstract:
A semiconductor device package may include a leadframe having a first portion with first extended portions and a second portion with second extended portions. Mold material may encapsulate a portion of the leadframe and a portion of a semiconductor die mounted to the leadframe. A first set of contacts of the semiconductor die may be connected to a first surface of the first extended portions, while a second set of contacts may be connected to a first surface of the second extended portions. A mold-locking cavity having the mold material included therein may be disposed in contact with a second surface of the first extended portions opposed to the first surface of the first extended portions, a second surface of the second extended portions opposed to the first surface of the second extended portions, the first portion of the leadframe, and the second portion of the leadframe.
Public/Granted literature
- US20220238421A1 MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES Public/Granted day:2022-07-28
Information query
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