公开(公告)号：US11075148B2

公开(公告)日：2021-07-27

申请号：US16675525

申请日：2019-11-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jeffrey Peter Gambino ,  David T. Price ,  Jeffery A. Neuls ,  Dean E. Probst ,  Santosh Menon ,  Peter A. Burke ,  Bigildis Dosdos

IPC: H01L23/00 ,  H01L23/495 ,  H01L25/00 ,  H01L25/11

Abstract: A stacked assembly of semiconductor devices includes a mounting pad covering a first portion of a low-side semiconductor device, and a contact layer covering a second portion of the low-side semiconductor device. A first mounting clip electrically connected to the contact layer has a supporting portion joining the first mounting clip to a first lead frame portion. A second mounting clip attached to the mounting pad has a supporting portion joining the second mounting clip to a second lead frame portion. A high-side semiconductor device has a first terminal electrically connected to the first mounting clip and thereby to the contact layer, and a second terminal electrically connected to the second mounting clip.

公开(公告)号：US11004777B2

公开(公告)日：2021-05-11

申请号：US16456161

申请日：2019-06-28

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome Teysseyre ,  Chung-Lin Wu ,  Bigildis Dosdos

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: In one general aspect, an apparatus can include a leadframe including a plurality of leads configured to provide electrical connections for the apparatus. The apparatus can also include a semiconductor die disposed on the leadframe and a conductive clip electrically coupling the semiconductor die with the leadframe. The apparatus can further include a heat slug disposed on the conductive clip. The heat slug can include a thermally conductive and electrically insulative material.

公开(公告)号：US12087677B2

公开(公告)日：2024-09-10

申请号：US17248382

申请日：2021-01-22

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Clemens Ypil Quinones ,  Bigildis Dosdos ,  Jerome Teysseyre ,  Erwin Ian Vamenta Almagro ,  Romel N Manatad

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/482 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L23/49562 ,  H01L21/4825 ,  H01L21/4828 ,  H01L23/3142 ,  H01L23/4824 ,  H01L23/4951 ,  H01L23/49568 ,  H01L23/544 ,  H01L23/562 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32258

Abstract: A semiconductor device package may include a leadframe having a first portion with first extended portions and a second portion with second extended portions. Mold material may encapsulate a portion of the leadframe and a portion of a semiconductor die mounted to the leadframe. A first set of contacts of the semiconductor die may be connected to a first surface of the first extended portions, while a second set of contacts may be connected to a first surface of the second extended portions. A mold-locking cavity having the mold material included therein may be disposed in contact with a second surface of the first extended portions opposed to the first surface of the first extended portions, a second surface of the second extended portions opposed to the first surface of the second extended portions, the first portion of the leadframe, and the second portion of the leadframe.

公开(公告)号：US11735508B2

公开(公告)日：2023-08-22

申请号：US17453623

申请日：2021-11-04

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome Teysseyre ,  Romel Manatad ,  Chung-Lin Wu ,  Bigildis Dosdos ,  Erwin Ian Almagro ,  Maria Cristina Estacio

IPC: H01L23/498 ,  H01L23/495

CPC classification number: H01L23/49827 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49586 ,  H01L2224/48137 ,  H01L2224/48247

Abstract: In a general aspect, an apparatus can include a leadframe including a plurality of leads disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe and an inductor having a first terminal and a second terminal. The first terminal of the inductor can be electrically coupled with the leadframe via a first contact pad of the leadframe. The second terminal of the inductor can be electrically coupled with the leadframe via a second contact pad of the leadframe. The first contact pad and the second contact pad can be exposed through a molding compound by respective mold cavities defined in the molding compound. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.