公开(公告)号：US12087677B2

公开(公告)日：2024-09-10

申请号：US17248382

申请日：2021-01-22

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Maria Clemens Ypil Quinones ,  Bigildis Dosdos ,  Jerome Teysseyre ,  Erwin Ian Vamenta Almagro ,  Romel N Manatad

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/482 ,  H01L23/00 ,  H01L23/544

CPC classification number: H01L23/49562 ,  H01L21/4825 ,  H01L21/4828 ,  H01L23/3142 ,  H01L23/4824 ,  H01L23/4951 ,  H01L23/49568 ,  H01L23/544 ,  H01L23/562 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32258

Abstract: A semiconductor device package may include a leadframe having a first portion with first extended portions and a second portion with second extended portions. Mold material may encapsulate a portion of the leadframe and a portion of a semiconductor die mounted to the leadframe. A first set of contacts of the semiconductor die may be connected to a first surface of the first extended portions, while a second set of contacts may be connected to a first surface of the second extended portions. A mold-locking cavity having the mold material included therein may be disposed in contact with a second surface of the first extended portions opposed to the first surface of the first extended portions, a second surface of the second extended portions opposed to the first surface of the second extended portions, the first portion of the leadframe, and the second portion of the leadframe.