Invention Grant
- Patent Title: Semiconductor structures with backside gate contacts
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Application No.: US17480531Application Date: 2021-09-21
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Publication No.: US12087691B2Publication Date: 2024-09-10
- Inventor: Ruilong Xie , Julien Frougier , Veeraraghavan S. Basker , Lawrence A. Clevenger , Nicolas Loubet , Dechao Guo , Kisik Choi , Kangguo Cheng , Carl Radens
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LIP
- Agent L. Jeffrey Kelly
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/768 ; H01L23/528 ; H01L29/06 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/786

Abstract:
A semiconductor structure comprises a substrate having a first side and a second side opposite the first side, and a gate for at least one transistor device disposed above the first side of the substrate. The structure may further include a buried power rail at least partially disposed in the substrate and a gate tie-down contact connecting the gate to the buried power rail from the second side of the substrate. The structure may further or alternatively include one or more source/drain regions disposed over the first side of the substrate, and a gate contact connecting to a portion of the gate from the second side of the substrate, the portion of the gate being adjacent to at least one of the one or more source/drain regions.
Public/Granted literature
- US20230086033A1 SEMICONDUCTOR STRUCTURES WITH BACKSIDE GATE CONTACTS Public/Granted day:2023-03-23
Information query
IPC分类: