- 专利标题: Magnetic random access memory device and method for fabricating the same
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申请号: US17361331申请日: 2021-06-29
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公开(公告)号: US12089504B2公开(公告)日: 2024-09-10
- 发明人: Yen-Tsai Yi , Wei-Chuan Tsai , Jin-Yan Chiou , Hsiang-Wen Ke
- 申请人: UNITED MICROELECTRONICS CORP.
- 申请人地址: TW Hsin-Chu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsin-Chu
- 代理商 Winston Hsu
- 优先权: CN 2110599237.6 2021.05.31
- 主分类号: H10N50/80
- IPC分类号: H10N50/80 ; H10B61/00 ; H10N50/01
摘要:
A method for fabricating a magnetic random access memory (MRAM) device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, forming a first top electrode on the MTJ stack, and then forming a second top electrode on the first top electrode. Preferably, the first top electrode includes a gradient concentration while the second top electrode includes a non-gradient concentration.
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