Thermosetting resin composite and metal clad laminate using the same
摘要:
The present disclosure relates to a thermosetting resin composite having a specific thermal stress factor, and capable of implementing a low glass transition temperature, low modulus, and a low coefficient of thermal expansion, and minimizing warpage, and having excellent flowability in a prepreg or semi-cured state, and a metal clad laminate using the same.
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