Invention Grant
- Patent Title: Active region array formation method
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Application No.: US17595589Application Date: 2021-03-12
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Publication No.: US12100594B2Publication Date: 2024-09-24
- Inventor: ChihCheng Liu
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2010303267.3 2020.04.17
- International Application: PCT/CN2021/080332 2021.03.12
- International Announcement: WO2021/208649A 2021.10.21
- Date entered country: 2021-11-19
- Main IPC: H01L21/033
- IPC: H01L21/033 ; H01L21/265 ; H01L21/266 ; H10B12/00

Abstract:
An active region array formation method is provided, including: providing a substrate, and forming a first hard mask layer on a surface of the substrate; patterning the first hard mask layer by using a composite etching process to form an active region shielding layer in the first hard mask layer, a pattern of the active region shielding layer being matched with a pattern of a to-be-formed active region array, wherein the composite etching process includes at least two patterning processes and at least one pattern transfer process; removing the remaining first hard mask layer; and forming the active region array in the substrate through the active region shielding layer.
Public/Granted literature
- US20220230881A1 ACTIVE REGION ARRAY FORMATION METHOD Public/Granted day:2022-07-21
Information query
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