Invention Grant
- Patent Title: Flexible circuit board
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Application No.: US18217958Application Date: 2023-07-03
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Publication No.: US12101879B2Publication Date: 2024-09-24
- Inventor: Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & ASSOCIATES, LLP
- Priority: KR 20150140252 2015.10.06
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/02 ; H05K1/03 ; H05K1/18 ; H05K3/28 ; H05K3/34 ; H05K1/11 ; H05K3/24

Abstract:
A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
Public/Granted literature
- US20230345632A1 FLEXIBLE CIRCUIT BOARD Public/Granted day:2023-10-26
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