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公开(公告)号：US10561016B2
公开(公告)日：2020-02-11
申请号：US16378943
申请日：2019-04-09
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon , Min Hwan Kim
Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
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公开(公告)号：US10020280B2
公开(公告)日：2018-07-10
申请号：US14791862
申请日：2015-07-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
IPC: H05K1/11 , H01L23/00 , H01L23/498
CPC classification number: H01L24/50 , H01L23/49838 , H01L23/4985 , H01L24/86 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
Abstract: The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
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公开(公告)号：US12080654B2
公开(公告)日：2024-09-03
申请号：US18197245
申请日：2023-05-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Young Lim , Hyung Kyu Yoon , Sung Min Chae
IPC: H01L23/538 , H01L23/00 , H01L23/498 , H01L25/16 , H01L25/18
CPC classification number: H01L23/5387 , H01L23/49866 , H01L23/5386 , H01L24/16 , H01L25/16 , H01L25/18 , H01L2224/16227
Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
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公开(公告)号：US11903119B2
公开(公告)日：2024-02-13
申请号：US17384892
申请日：2021-07-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Chae Won Kang , Jun Young Lim
IPC: H05K1/02 , H01L23/00 , H01L23/498 , H05K1/18
CPC classification number: H05K1/0206 , H01L23/4985 , H01L23/49838 , H01L24/17 , H05K1/189 , H01L24/16 , H01L2224/16225 , H01L2224/17519
Abstract: A flexible circuit board for a chip on film according to an embodiment includes: a substrate including a first surface and a second surface opposite to the first surface and including a chip mounting region; a circuit pattern layer disposed on the first surface; and a heat dissipation part disposed in the chip mounting region, wherein the substrate is formed with at least two or more holes that are formed in a region overlapping the heat dissipation part, and the heat dissipation part includes: a heat dissipation pattern layer disposed on the first surface; a connection layer disposed inside the hole; and a heat dissipation layer disposed on the second surface.
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公开(公告)号：US11744014B2
公开(公告)日：2023-08-29
申请号：US17523421
申请日：2021-11-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon
CPC classification number: H05K1/09 , H05K1/028 , H05K1/0393 , H05K1/181 , H05K3/28 , H05K3/3452 , H05K1/111 , H05K1/18 , H05K1/189 , H05K3/244 , H05K2201/0154 , H05K2201/0191 , H05K2201/0338 , H05K2201/10136
Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
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Patent Agency Ranking
公开(公告)号：US12101879B2
公开(公告)日：2024-09-24
申请号：US18217958
申请日：2023-07-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon
CPC classification number: H05K1/09 , H05K1/028 , H05K1/0393 , H05K1/181 , H05K3/28 , H05K3/3452 , H05K1/111 , H05K1/18 , H05K1/189 , H05K3/244 , H05K2201/0154 , H05K2201/0191 , H05K2201/0338 , H05K2201/10136
Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.
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公开(公告)号：US20220151076A1
公开(公告)日：2022-05-12
申请号：US17520855
申请日：2021-11-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Dae Sung Yoo , Jun Young Lim
Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.
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公开(公告)号：US10020248B2
公开(公告)日：2018-07-10
申请号：US15153970
申请日：2016-05-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Dae Sung Yoo , Han Mo Koo , Ki Tae Park , Jun Young Lim , Tae Ki Hong
IPC: H05K7/02 , H01L23/498 , H01L23/495 , H01L23/31 , H01L23/492 , H01L23/00
CPC classification number: H01L23/49811 , H01L23/315 , H01L23/4924 , H01L23/49572 , H01L23/49582 , H01L23/49838 , H01L23/49894 , H01L24/50 , H01L24/86 , H01L2924/0002 , H05K7/02 , H01L2924/00
Abstract: Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting portion on a narrow circuit pattern to be connected from an inner lead to an outer lead and further forming the cutting portion within a resin application portion, the problem of occurrence of cracks along a width of a narrow wiring can be avoided. The tape may include a first lead and a second lead formed on a dielectric substrate and a cutting portion formed on one of the first lead and the second lead wherein the cutting portion is formed within a resin application portion.
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公开(公告)号：US20150311176A1
公开(公告)日：2015-10-29
申请号：US14791862
申请日：2015-07-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
IPC: H01L23/00
CPC classification number: H01L24/50 , H01L23/49838 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
Abstract: The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
Abstract translation: 本发明涉及一种TAB封装用载带及其制造方法，其特征在于，包括具有中心区域和中心区域的两个方向的边缘区域的基膜的TAB带，形成在中央区域的中央区域的布线图案 基膜，形成在基膜的边缘区域并被基膜曝光的转印区域，在转印区域上排列成一排的多个链轮孔和从布线图案离散地形成的金属图案，并形成在 基底膜的边缘区域，其中金属图案形成有形成在多个链轮孔的两侧的成对结构，使得本发明具有有利的效果，即在一个或多个链条中不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的部分链轮，以排除诸如Cu颗粒的异物的产生，从而 提高产品的可靠性。
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公开(公告)号：US11800639B2
公开(公告)日：2023-10-24
申请号：US18115218
申请日：2023-02-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon , Min Hwan Kim
CPC classification number: H05K1/0281 , H01L21/481 , H01L21/4821 , H01L23/4985 , H01L24/16 , H05K1/0271 , H05K1/144 , H05K3/18 , H05K3/28 , H01L21/4867 , H01L23/49827 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H05K1/189 , H05K2201/055 , H05K2201/10128
Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
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