公开(公告)号：US11744014B2

公开(公告)日：2023-08-29

申请号：US17523421

申请日：2021-11-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/28 ,  H05K1/03 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US11800639B2

公开(公告)日：2023-10-24

申请号：US18115218

申请日：2023-02-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon ,  Min Hwan Kim

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/18

CPC classification number: H05K1/0281 ,  H01L21/481 ,  H01L21/4821 ,  H01L23/4985 ,  H01L24/16 ,  H05K1/0271 ,  H05K1/144 ,  H05K3/18 ,  H05K3/28 ,  H01L21/4867 ,  H01L23/49827 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/10128

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US11622444B2

公开(公告)日：2023-04-04

申请号：US17836405

申请日：2022-06-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon ,  Min Hwan Kim

IPC: H05K1/02 ,  H05K3/28 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/18 ,  H05K1/18

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US11202367B2

公开(公告)日：2021-12-14

申请号：US16688476

申请日：2019-11-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/28 ,  H05K1/03 ,  H05K3/24

Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US10912192B2

公开(公告)日：2021-02-02

申请号：US16733346

申请日：2020-01-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon ,  Min Hwan Kim

IPC: H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H01L23/00 ,  H01L21/48 ,  H05K3/18

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US10517172B2

公开(公告)日：2019-12-24

申请号：US15765308

申请日：2016-09-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K3/34 ,  H05K3/24

Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US10321562B2

公开(公告)日：2019-06-11

申请号：US15657296

申请日：2017-07-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon ,  Min Hwan Kim

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H05K1/14 ,  H05K1/18 ,  H05K3/18 ,  H05K3/28

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US12101879B2

公开(公告)日：2024-09-24

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20230345632A1

公开(公告)日：2023-10-26

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik Kim ,  Kyung Kyu Yoon

IPC: H05K1/09 ,  H05K3/34 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/09 ,  H05K3/3452 ,  H05K1/181 ,  H05K3/28 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US10561016B2

公开(公告)日：2020-02-11

申请号：US16378943

申请日：2019-04-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon ,  Min Hwan Kim

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18 ,  H05K1/18

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.