- 专利标题： Singulation of microelectronic components with direct bonding interfaces
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申请号： US17032469申请日： 2020-09-25
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公开(公告)号： US12119317B2公开(公告)日： 2024-10-15
- 发明人: Bhaskar Jyoti Krishnatreya , Nagatoshi Tsunoda , Shawna M. Liff , Sairam Agraharam
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Akona IP PC
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/48 ; H01L21/56 ; H01L23/31 ; H01L23/367 ; H01L23/538 ; H01L25/00 ; H01L25/065
摘要：
Disclosed herein are structures and techniques related to singulation of microelectronic components with direct bonding interfaces. For example, in some embodiments, a microelectronic component may include: a surface, wherein conductive contacts are at the surface; a trench at a perimeter of the surface; and a burr in the trench.
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