Invention Grant
- Patent Title: Sensor with housing and silicone resin filler
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Application No.: US17633334Application Date: 2021-06-15
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Publication No.: US12123746B2Publication Date: 2024-10-22
- Inventor: Abraham Kho , Andi Permana , Heinz Strallhofer
- Applicant: TDK Electronics AG
- Applicant Address: DE Munich
- Assignee: TDK Electronics AG
- Current Assignee: TDK Electronics AG
- Current Assignee Address: DE Munich
- Agency: Slater Matsil, LLP
- Priority: DE 2020116018.6 2020.06.17
- International Application: PCT/EP2021/066067 2021.06.15
- International Announcement: WO2021/255005A 2021.12.23
- Date entered country: 2022-02-07
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01K1/08 ; G01R22/00
Abstract:
In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.
Public/Granted literature
- US20220291053A1 Sensor with Housing and Silicone Resin Filler Public/Granted day:2022-09-15
Information query
