公开(公告)号：US20250003777A1

公开(公告)日：2025-01-02

申请号：US18828884

申请日：2024-09-09

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01D11/24 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening, and a silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing, wherein the silicone resin is a hard silicone material, and wherein the hard silicone material is more rigid than a soft silicone material.

公开(公告)号：US20220291053A1

公开(公告)日：2022-09-15

申请号：US17633334

申请日：2021-06-15

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01K7/16 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.

公开(公告)号：US10770204B2

公开(公告)日：2020-09-08

申请号：US16611294

申请日：2018-07-12

Applicant: TDK Electronics AG

Inventor： Gerald Kloiber ,  Heinz Strallhofer

IPC: H01C1/144 ,  H01C1/14 ,  H01C17/28 ,  H01R4/02 ,  H01R4/62

Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

公开(公告)号：US12123746B2

公开(公告)日：2024-10-22

申请号：US17633334

申请日：2021-06-15

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01D11/24 ,  G01K1/08 ,  G01R22/00

CPC classification number: G01D11/245 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.

公开(公告)号：US20220326088A1

公开(公告)日：2022-10-13

申请号：US17634603

申请日：2020-08-20

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01K1/08 ,  G01D11/24 ,  G01K7/22

Abstract: A sensor including a sensor element and electrical leads, whereby the sensor element is connected to the electrical leads. Further, a housing is provided, whereby the housing has an opening, and the sensor element is arranged in the housing such that the electrical leads protrude from the opening. The housing is filled with epoxy resin and the epoxy resin fixes the sensor element and the electrical leads in the housing.

公开(公告)号：US20200066428A1

公开(公告)日：2020-02-27

申请号：US16611294

申请日：2018-07-12

Applicant: TDK Electronics AG

Inventor： Gerald Kloiber ,  Heinz Strallhofer

IPC: H01C1/144 ,  H01C1/14 ,  H01C17/28 ,  H01R4/02 ,  H01R4/62

Abstract: An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.