公开(公告)号：US12123746B2

公开(公告)日：2024-10-22

申请号：US17633334

申请日：2021-06-15

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01D11/24 ,  G01K1/08 ,  G01R22/00

CPC classification number: G01D11/245 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.

公开(公告)号：US20220326088A1

公开(公告)日：2022-10-13

申请号：US17634603

申请日：2020-08-20

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01K1/08 ,  G01D11/24 ,  G01K7/22

Abstract: A sensor including a sensor element and electrical leads, whereby the sensor element is connected to the electrical leads. Further, a housing is provided, whereby the housing has an opening, and the sensor element is arranged in the housing such that the electrical leads protrude from the opening. The housing is filled with epoxy resin and the epoxy resin fixes the sensor element and the electrical leads in the housing.

公开(公告)号：US20250003777A1

公开(公告)日：2025-01-02

申请号：US18828884

申请日：2024-09-09

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01D11/24 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening, and a silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing, wherein the silicone resin is a hard silicone material, and wherein the hard silicone material is more rigid than a soft silicone material.

公开(公告)号：US20220291053A1

公开(公告)日：2022-09-15

申请号：US17633334

申请日：2021-06-15

Applicant: TDK Electronics AG

Inventor： Abraham Kho ,  Andi Permana ,  Heinz Strallhofer

IPC: G01K7/16 ,  G01K1/08 ,  G01R22/00

Abstract: In an embodiment a sensor includes a sensor element, electrical leads connected to the sensor element, a housing having an opening, wherein the sensor element is arranged in the housing such that the electrical leads protrude through the opening and a first silicone resin filling the housing such that the sensor element and the electrical leads are fixed in the housing.