- 专利标题: Extreme ultraviolet mask with reduced wafer neighboring effect
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申请号: US18343493申请日: 2023-06-28
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公开(公告)号: US12130548B2公开(公告)日: 2024-10-29
- 发明人: Wen-Chang Hsueh , Huan-Ling Lee , Chia-Jen Chen , Hsin-Chang Lee
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 分案原申请号: US17244662 2021.04.29
- 主分类号: G03F1/22
- IPC分类号: G03F1/22 ; G03F1/24 ; G03F1/48 ; G03F1/52 ; G03F1/58 ; H01L21/027
摘要:
A reticle is provided. The reticle includes a first reflective multilayer (ML) over a mask substrate and a capping layer over the first reflective ML. The reticle also includes a first absorption layer over the capping layer and a second reflective multilayer (ML) over the first absorption layer. The reticle further includes an etch stop layer over the second reflective ML and a third reflective multilayer (ML) over the etch stop layer. In addition, the reticle includes an absorption film pair over the third reflective ML.
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