Invention Grant
- Patent Title: Cooling mass and spring element for low insertion force hot swappable electronic component interface
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Application No.: US17697877Application Date: 2022-03-17
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Publication No.: US12133368B2Publication Date: 2024-10-29
- Inventor: Hardeep Singh , Rachit Sharma , Timothy Glen Hanna , Devdatta P. Kulkarni
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14

Abstract:
An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.
Public/Granted literature
- US20220210952A1 COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE Public/Granted day:2022-06-30
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