公开(公告)号：US10168749B2

公开(公告)日：2019-01-01

申请号：US15366799

申请日：2016-12-01

Applicant: Intel Corporation

Inventor： Russell S. Aoki ,  Devdatta P. Kulkarni ,  Alan W. Tate ,  Robin A. Steinbrecher ,  Ralph W. Jensen

IPC: H05K7/20 ,  G06F1/20 ,  F28F9/26 ,  H05K1/02 ,  H05K1/18 ,  H01L23/40 ,  H01L23/473

Abstract: Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

公开(公告)号：US20180270993A1

公开(公告)日：2018-09-20

申请号：US15462261

申请日：2017-03-17

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Sandeep Ahuja

IPC: H05K7/20 ,  F28D15/04

CPC classification number: H05K7/20336 ,  F28D1/0477 ,  F28D15/046 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20809

Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide an evaporator including a chamber to receive condensate flow from an input end and output a vapor outflow at an output end with a wick, heated by a surface of the chamber, having variable thickness within the chamber to receive condensate, where the thickness of the wick proximate to the condensate inflow is greater than the thickness of the wick proximate to the vapor outflow. Other embodiments may be described and/or claimed.

公开(公告)号：US11249522B2

公开(公告)日：2022-02-15

申请号：US15199003

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Timothy G. Hanna

IPC: G06F1/20 ,  F25B21/02

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

公开(公告)号：US10765039B2

公开(公告)日：2020-09-01

申请号：US15605802

申请日：2017-05-25

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Xudong Tang

IPC: H05K7/20

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

公开(公告)号：US20190004573A1

公开(公告)日：2019-01-03

申请号：US15637439

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: G06F1/20 ,  H01L23/367 ,  H01L23/495 ,  H01L21/02

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

公开(公告)号：US11026351B2

公开(公告)日：2021-06-01

申请号：US15754957

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: The present disclosure describes embodiments of apparatuses and methods related to a computing apparatus with a closed cooling loop thermally coupled to one or more processors disposed on a circuit board of the computing apparatus. The closed cooling loop circulates a dielectric fluid to absorb heat from the processor. A portion of the dielectric fluid is evaporated from the processor heat absorbed by the dielectric fluid. A heat exchanger is coupled to the circuit board and thermally coupled to the closed cooling loop. The heat exchanger is to include a coolant flow to remove heat from the dielectric fluid circulated through the portion of the closed cooling loop thermally coupled to the heat exchanger. A vapor portion of the dielectric fluid is condensed from the heat removed by the coolant flow. Other embodiments may be described and/or claimed.

公开(公告)号：US10228735B2

公开(公告)日：2019-03-12

申请号：US15637439

申请日：2017-06-29

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Richard J. Dischler ,  Je-Young Chang

IPC: G06F1/20 ,  H01L21/02 ,  H01L23/367 ,  H01L23/495

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.

公开(公告)号：US09983641B2

公开(公告)日：2018-05-29

申请号：US15140014

申请日：2016-04-27

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Timothy G. Hanna

IPC: G06F1/20 ,  H01L35/00 ,  H01L21/00 ,  H01L37/00

CPC classification number: G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H01L21/00 ,  H01L35/00 ,  H01L37/00

Abstract: Methods, apparatuses, and systems associated with tunable pumped two-phase liquid cooling thermal management are disclosed. In embodiments, a tunable cooling apparatus may include a thermoelectric cooler device, TEC, that has a hot side and a cold side, where the cold side is to cool the coolant in route to an inlet manifold of the cold plate before the coolant enters the inlet manifold, and the hot side may be to warm the coolant in route from an outlet manifold of the cold plate after the coolant flows through the cold plate and exits the outlet manifold and or vice versa. In embodiments, the coolant may be either in a liquid state or in a vapor state. Other embodiments may be described and/or claimed.

公开(公告)号：US20180004259A1

公开(公告)日：2018-01-04

申请号：US15199003

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Devdatta P. Kulkarni ,  Timothy G. Hanna

IPC: G06F1/20 ,  F25B21/02

CPC classification number: G06F1/20 ,  F25B21/02 ,  G06F1/203 ,  G06F1/206 ,  G06F2200/201

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

公开(公告)号：US12133368B2

公开(公告)日：2024-10-29

申请号：US17697877

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Hardeep Singh ,  Rachit Sharma ,  Timothy Glen Hanna ,  Devdatta P. Kulkarni

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20772 ,  H05K7/1489 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/2049

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.