公开(公告)号：US12133368B2

公开(公告)日：2024-10-29

申请号：US17697877

申请日：2022-03-17

Applicant: Intel Corporation

Inventor： Hardeep Singh ,  Rachit Sharma ,  Timothy Glen Hanna ,  Devdatta P. Kulkarni

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20772 ,  H05K7/1489 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/2049

Abstract: An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.