Invention Grant
- Patent Title: Roller for location-specific wafer polishing
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Application No.: US17684285Application Date: 2022-03-01
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Publication No.: US12138733B2Publication Date: 2024-11-12
- Inventor: Ekaterina A. Mikhaylichenko , Fred C. Redeker , Brian J. Brown , Chirantha Rodrigo , Steven M. Zuniga , Jay Gurusamy
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/04
- IPC: B24B37/04 ; B24B37/11
Abstract:
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.
Public/Granted literature
- US12194591B2 Roller for location-specific wafer polishing Public/Granted day:2025-01-14
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