公开(公告)号：US20240017376A1

公开(公告)日：2024-01-18

申请号：US18352446

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B49/04 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

CPC classification number: B24B49/045 ,  B24B57/02 ,  B24B37/013 ,  B24B37/26

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US12194591B2

公开(公告)日：2025-01-14

申请号：US17684285

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/04 ,  B24B37/11

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US20240017371A1

公开(公告)日：2024-01-18

申请号：US18352432

申请日：2023-07-14

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Chirantha Rodrigo ,  Ekaterina A. Mikhaylichenko ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Dominic J. Benvegnu ,  Lakshmanan Karuppiah

IPC: B24B37/013

CPC classification number: B24B37/013

Abstract: A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, one or more actuators to bring the polishing surface into contact with a first portion of the exposed surface of the substrate and to generate relative motion between the substrate and the polishing pad and optically transmissive polymer window, an in-situ optical monitoring system, and a controller configured to receive a signal from the optical in-situ monitoring system and to modifying a polishing parameter based on the signal. The optical monitoring system includes a light source and a detector, the in-situ optical monitoring system configured to direct a light beam from above the support to impinge a non-overlapping second portion of the exposed surface of the substrate.

公开(公告)号：US12138733B2

公开(公告)日：2024-11-12

申请号：US17684285

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/04 ,  B24B37/11

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US20220281062A1

公开(公告)日：2022-09-08

申请号：US17684285

申请日：2022-03-01

Applicant: Applied Materials, Inc.

Inventor： Ekaterina A. Mikhaylichenko ,  Fred C. Redeker ,  Brian J. Brown ,  Chirantha Rodrigo ,  Steven M. Zuniga ,  Jay Gurusamy

IPC: B24B37/04 ,  B24B37/11

Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.

公开(公告)号：US10026597B2

公开(公告)日：2018-07-17

申请号：US15397429

申请日：2017-01-03

Applicant: Applied Materials, Inc.

Inventor： Chirantha Rodrigo ,  Jingchun Zhang ,  Lili Ji ,  Anchuan Wang ,  Nitin K. Ingle

IPC: H01J37/32 ,  H01L21/311 ,  C23C16/44 ,  H01L21/67

Abstract: The present disclosure provides methods for cleaning chamber components post substrate etching. In one example, a method for cleaning includes activating an etching gas mixture using a plasma to create an activated etching gas mixture, the etching gas mixture comprising hydrogen-containing precursor and a fluorine-containing precursor and delivering the activated etching gas mixture to a processing region of a process chamber, the process chamber having an edge ring positioned therein, the edge ring comprising a catalyst and anticatalytic material, wherein the activated gas removes the anticatalytic material from the edge ring.