Invention Grant
- Patent Title: Wiring board and method for manufacturing wiring board
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Application No.: US17290633Application Date: 2019-10-31
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Publication No.: US12144108B2Publication Date: 2024-11-12
- Inventor: Naoko Okimoto , Kenichi Ogawa , Mitsutaka Nagae , Makiko Sakata , Toru Miyoshi
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Agency: Oliff PLC
- Priority: JP2018-206039 20181031,JP2019-075182 20190410
- International Application: PCT/JP2019/042916 WO 20191031
- International Announcement: WO2020/091010 WO 20200507
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/10

Abstract:
A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.
Public/Granted literature
- US20210385946A1 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD Public/Granted day:2021-12-09
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