公开(公告)号：US11744011B2

公开(公告)日：2023-08-29

申请号：US17290304

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kenichi Ogawa ,  Naoko Okimoto ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0064 ,  H05K3/1208 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

公开(公告)号：US12144108B2

公开(公告)日：2024-11-12

申请号：US17290633

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Naoko Okimoto ,  Kenichi Ogawa ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/02 ,  H05K3/10

Abstract: A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.

公开(公告)号：US11653444B2

公开(公告)日：2023-05-16

申请号：US17439326

申请日：2020-03-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Naoko Okimoto ,  Mitsutaka Nagae ,  Kenichi Ogawa ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0283 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0162

Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.