-
公开(公告)号：US10959326B2
公开(公告)日：2021-03-23
申请号：US16761155
申请日：2018-10-12
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Naoko Okimoto , Kenichi Ogawa
Abstract: A stretchable circuit substrate includes: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.
-
公开(公告)号：US11744011B2
公开(公告)日：2023-08-29
申请号：US17290304
申请日：2019-10-31
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Kenichi Ogawa , Naoko Okimoto , Mitsutaka Nagae , Makiko Sakata , Toru Miyoshi
CPC classification number: H05K1/0283 , H05K1/189 , H05K3/0014 , H05K3/0064 , H05K3/1208 , H05K2201/09063 , H05K2201/09281 , H05K2201/2009
Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.
-
公开(公告)号：US11109479B2
公开(公告)日：2021-08-31
申请号：US16755780
申请日：2018-10-12
Applicant: DAI NIPPON PRINTING CO., LTD. , THE UNIVERSITY OF TOKYO
Inventor： Naoko Okimoto , Kenichi Ogawa , Takao Someya
Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.
-
Patent Agency Ranking
公开(公告)号：US11778737B2
公开(公告)日：2023-10-03
申请号：US17388448
申请日：2021-07-29
Applicant: DAI NIPPON PRINTING CO., LTD. , THE UNIVERSITY OF TOKYO
Inventor： Naoko Okimoto , Kenichi Ogawa , Takao Someya
CPC classification number: H05K1/0283 , H05K1/0393 , H05K3/0014
Abstract: A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.
-
公开(公告)号：US11612054B2
公开(公告)日：2023-03-21
申请号：US16755648
申请日：2018-10-12
Applicant: DAI NIPPON PRINTING CO., LTD. , THE UNIVERSITY OF TOKYO
Inventor： Naoko Okimoto , Kenichi Ogawa , Takao Someya
Abstract: A substrate that is stretchable; wiring positioned on a first surface side of the substrate, the wiring having a meandering shape section including peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The substrate has a component region and a wiring region adjacent to the component region. The component region includes a component-fixing region overlapping an electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate and a component-surrounding region positioned around the component-fixing region. The stretching control mechanism is positioned in the component-surrounding region and at least includes a stretching control part that spreads to the border between the component-surrounding region and the component-fixing region.
-
公开(公告)号：US12144108B2
公开(公告)日：2024-11-12
申请号：US17290633
申请日：2019-10-31
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Naoko Okimoto , Kenichi Ogawa , Mitsutaka Nagae , Makiko Sakata , Toru Miyoshi
Abstract: A wiring board includes a substrate, wiring, and a reinforcing part. The substrate is stretchable, and includes a first surface and a second surface located opposite to the first surface. The wiring is located at the first surface side of the substrate. The reinforcing part overlaps the wiring when viewed in a direction normal to the first surface of the substrate. The substrate has a control region and a non-control region. The control region overlaps the reinforcing part. The non-control region does not overlap the reinforcing part. The non-control region is positioned to sandwich the control region in a direction orthogonal to the direction in which the wiring extends.
-
公开(公告)号：US11653444B2
公开(公告)日：2023-05-16
申请号：US17439326
申请日：2020-03-19
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Naoko Okimoto , Mitsutaka Nagae , Kenichi Ogawa , Makiko Sakata , Toru Miyoshi
CPC classification number: H05K1/0283 , H05K3/4688 , H05K2201/0133 , H05K2201/0162
Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.
-
公开(公告)号：US11172570B2
公开(公告)日：2021-11-09
申请号：US17148641
申请日：2021-01-14
Applicant: DAI NIPPON PRINTING CO., LTD.
Inventor： Naoko Okimoto , Kenichi Ogawa
Abstract: The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.019 seconds)
