Invention Grant
- Patent Title: High performance memory module with reduced loading
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Application No.: US17214770Application Date: 2021-03-26
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Publication No.: US12147698B2Publication Date: 2024-11-19
- Inventor: Bill Nale , George Vergis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law PC
- Main IPC: G06F3/00
- IPC: G06F3/00 ; G06F3/06

Abstract:
An apparatus is described. The apparatus includes a register clock driver (RCD) semiconductor chip having first inputs to receive first command and address (CA) signals from a first sub-channel and first outputs to drive first and second instances of the CA information that are decoded from the first CA signals. The RCD semiconductor chip has second inputs to receive second command and address (CA) signals from a second sub-channel. The RCD semiconductor chip has a multiplexer having a first input channel to receive the first CA signals and a second input channel to receive the second CA signals. The RCD semiconductor chip has second outputs to drive third and fourth instances of the first CA information or first and second instances of the second CA information that are decoded from the second CA signals depending on which of the first and second input channels of the multiplexer is selected.
Public/Granted literature
- US20210216238A1 HIGH PERFORMANCE MEMORY MODULE WITH REDUCED LOADING Public/Granted day:2021-07-15
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