Invention Grant
- Patent Title: Method of manufacturing semiconductor devices
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Application No.: US18223993Application Date: 2023-07-19
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Publication No.: US12153350B2Publication Date: 2024-11-26
- Inventor: Ru-Gun Liu , Huicheng Chang , Chia-Cheng Chen , Jyu-Horng Shieh , Liang-Yin Chen , Shu-Huei Suen , Wei-Liang Lin , Ya Hui Chang , Yi-Nien Su , Yung-Sung Yen , Chia-Fong Chang , Ya-Wen Yeh , Yu-Tien Shen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F1/22 ; G03F1/36 ; G03F1/70 ; G03F7/40 ; H01L21/027

Abstract:
In a method of forming a pattern, a photo resist layer is formed over an underlying layer, the photo resist layer is exposed to an actinic radiation carrying pattern information, the exposed photo resist layer is developed to form a developed resist pattern, a directional etching operation is applied to the developed resist pattern to form a trimmed resist pattern, and the underlying layer is patterned using the trimmed resist pattern as an etching mask.
Public/Granted literature
- US20240019787A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES Public/Granted day:2024-01-18
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