Invention Grant
- Patent Title: Gate-all-around integrated circuit structures having germanium-doped nanoribbon channel structures
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Application No.: US16913294Application Date: 2020-06-26
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Publication No.: US12166124B2Publication Date: 2024-12-10
- Inventor: Ryan Hickey , Glenn A. Glass , Anand S. Murthy , Rushabh Shah , Ju-Hyung Nam
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/423 ; H01L29/786 ; H01L29/167

Abstract:
Gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, and methods of fabricating gate-all-around integrated circuit structures having germanium-doped nanowire/nanoribbon channel structures, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires above a substrate. Individual ones of the vertical arrangement of nanowires have a relatively higher germanium concentration at a lateral mid-point of the nanowire than at lateral ends of the nanowire.
Public/Granted literature
- US20210408285A1 GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING GERMANIUM-DOPED NANORIBBON CHANNEL STRUCTURES Public/Granted day:2021-12-30
Information query
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